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1 reflow attachment
прикріплення (напр. кристала) оплавленням припоюEnglish-Ukrainian dictionary of microelectronics > reflow attachment
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2 attachment
1) (при) єднання; (при) кріплення 2) пристосування; приналежність - epoxy die attachment
- eutectic die attachment
- flip-chip attachment
- flywire attachment
- lead-frame attachment
- reflow attachment
- solder die attachmentEnglish-Ukrainian dictionary of microelectronics > attachment
См. также в других словарях:
Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Selective soldering — is the process of selectively soldering components to printed circuit boards, molded modules, etc. that could be damaged by the heat of a reflow oven in a traditional SMT assembly process. Consequently this process usually follows an SMT oven… … Wikipedia
Portable Document Format — PDF redirects here. For other uses, see PDF (disambiguation). Portable Document Format Adobe Reader icon Filename extension .pdf Internet media type application/pdf application/x pdf application/x bzpdf application/x gzpdf … Wikipedia